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Active-braze™ Filler Metals
Active-braze™ No.10 Brazing Paste Grade B420P 80 provides a silver, copper, titanium type active brazing filler metal in paste form and is intended principally for brazing non-metallised alumina ceramics to a metallic substrate.
It can also be used for brazing a wide range of other non-metallic materials to themselves, or to metallic substrates without the need for metallisation.
Active-braze™ No.15 is used for the brazing of ceramics like alumina and zirconia, diamond, natural, single crystal, or Chemical Vapour Deposition (CVD) types, as well as graphite, sapphire, silicon carbide, Poly-Crystalline Diamond (PCD) and Poly-crystalline Cubic Boron Nitride (PCBN) to themselves or to metallic substrates like low expansion nickel alloys, copper and tungsten carbide.
Active-braze Filler Metals
Active-braze™ No. 1
Melting Range
860 - 912°C
Information on this product will appear here soon.
If you require more details on this product please submit a request through the 'Contact Us' section of this web site.
Active-braze™ No. 2
Melting Range
830 - 850°C
Information on this product will appear here soon.
If you require more details on this product please submit a request through the 'Contact Us' section of this web site.
Active-braze™ No. 10
Melting Range
780 - 800°C
Active-braze™ No.10 Brazing Paste is a specialised brazing paste for the active brazing of non-metallic materials. It can be used for the brazing of ceramics like alumina and zirconia, diamond, natural, single crystal or CVD (chemical vapour deposition) types, as well as graphite, sapphire, silicon carbide and PCBN to themselves or to metallic substrates like low expansion nickel alloys, copper and tungsten carbide.
Active-braze™ No. 15
Melting Range
620 - 720°C
Active-braze™ No.15 Brazing Paste is a specialised brazing paste for the active brazing of non-metallic materials. It is used for the brazing of ceramics like alumina and zirconia, diamond, natural, single crystal, or CVD (chemical vapour deposition) types, as well as graphite, sapphire, silicon carbide, PCD and PCBN to themselves or to metallic substrates like low expansion nickel alloys, copper and tungsten carbide.
